lurkswithin
Fully Optimized
- Messages
- 1,690
BTX, the new formfactor that is being brought out right as we speak.
For gamers This is going to be the best thing out for heating issues.
Basically what it is is a new conformity for case building and chip cooling issues.
Two things that really set it apart.
1) a retention plate that will mount below the motherboard to support a massive cooling module.
2) a new configuration for drive storage mounting that seperates the open spaces of a case into two compartments that will allow things hot..to remain hot and those that need to remain cool...to remain cool. QuaterPounder any one?
Now not to worry as the BTX formfactor is similar to the ATX. Actually the miniATX would be better comparisson. All the components are basically the same and will interchange without difficulty. It is the building proccess that has changed drastically. while this is set up more for Intel's pentium4 proccessor but look for amd to incorporate it also simply because of the cooling potential and less power requirements of the system itself. All this means that there will be less need for the large amounts of fans within the system and thus less pull on the PSU and more power for the chip without a massive increase of power supply usage.
All brought about by the pocketing aspect of the case. No longer will the board be placed close to the off side of the case but more centrally located and will in itself act as a buffer to seperate hot air from the add-in cards for more efficient cooling of them. The cooling for the chip and mobo will be on the underside by the cooling module (massive heat sink, but much more efficient)This is also within a chamber or pocket if you will so it is isolated from the add-in cards and disc drives. Speaking of which. The drives will be isolated within their own space too. All this means that your new build will now have a more accurate way to monitor heat issues which will be more or less non existant as the other vendors are building to the cooling module aspect also.
A 115w P4 prescott running 3.4gigs was ran for hours and reported cooler temps by almost half. The thermal module ran only at 900 rpm compared to 3000 to 5000 rpm's
more to follow.
For gamers This is going to be the best thing out for heating issues.
Basically what it is is a new conformity for case building and chip cooling issues.
Two things that really set it apart.
1) a retention plate that will mount below the motherboard to support a massive cooling module.
2) a new configuration for drive storage mounting that seperates the open spaces of a case into two compartments that will allow things hot..to remain hot and those that need to remain cool...to remain cool. QuaterPounder any one?
Now not to worry as the BTX formfactor is similar to the ATX. Actually the miniATX would be better comparisson. All the components are basically the same and will interchange without difficulty. It is the building proccess that has changed drastically. while this is set up more for Intel's pentium4 proccessor but look for amd to incorporate it also simply because of the cooling potential and less power requirements of the system itself. All this means that there will be less need for the large amounts of fans within the system and thus less pull on the PSU and more power for the chip without a massive increase of power supply usage.
All brought about by the pocketing aspect of the case. No longer will the board be placed close to the off side of the case but more centrally located and will in itself act as a buffer to seperate hot air from the add-in cards for more efficient cooling of them. The cooling for the chip and mobo will be on the underside by the cooling module (massive heat sink, but much more efficient)This is also within a chamber or pocket if you will so it is isolated from the add-in cards and disc drives. Speaking of which. The drives will be isolated within their own space too. All this means that your new build will now have a more accurate way to monitor heat issues which will be more or less non existant as the other vendors are building to the cooling module aspect also.
A 115w P4 prescott running 3.4gigs was ran for hours and reported cooler temps by almost half. The thermal module ran only at 900 rpm compared to 3000 to 5000 rpm's
more to follow.
